主要应用于SMD贴片电子元件如:MLCC, SMD Capacitors,SMD resistors,SMD Inductors等生产过程中,电镀时作为辅助导体之用。 其基本材质是碳钢,表面电镀锡和镍,镀层厚度大于3µm。 根据不同客户的需求,钢珠的规格型号多达十几个,尺寸范围在Ø0.2以上的都可以提供。 It is used to SMD (for example: MLCC, SMD Capacitors,SMD resistors,SMD Inductors) plating. The basic material of electric steel ball (plating steel ball) is carbon steel ball plated by tin and nickel. The plating layer will be thicker than 3µm. Based on customers requirement, electric steel ball has many specifications, from min. Ø0.2 to Ø1.2. The diameter and plating layer thickness can be customised.